Insights in PIC technology
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This work’s central question is: Can close co-integration of the electronic and photonic circuits increase high-speed performance? Co-integrated transceivers usually contain electronic drivers and photonic modulators. In this work, a high-speed Mach Zehnder Modulator (MZM) does the electro-optical modulation.
Photonic integration in a micrometer-thick indium phosphide (InP) membrane on silicon (IMOS) offers intrinsic and high-performance optoelectronic functions together with high-index-contrast nanophotonic circuitries.
An overview of recent developments regarding technology and devices, including include low propagation losses, plasmonic waveguides, a variety of laser structures, and improved wavelength demultiplexers.
A perspective showing the high potential for breaking speed, energy and density bottlenecks in conventional photonic integration technologies.
The antibunching properties of multiple single photons located are confirmed at distinct optical modes in a quantum frequency comb.
The first successful integration of integrating non-volatile phase change material (PCM) on InP photonic circuits.
Experimental study of the performance of directional couplers fabricated in indium-phosphide membrane on silicon (IMOS) technology.
Quantum interference measurements using photon pairs generated via cavity enhanced spontaneous four-wave mixing.
The experimental performance of a compact beamformer fabricated on the novel InP membrane on silicon platform exhibiting large steering angle (±90˚ at 26 GHz), high throughput (12 Gbps), and fast reconfiguration time (~250 ns).
This special issue includes 19 papers on InP integrated photonics capturing some of the most important recent advances, and providing a reference point for current state of the art.