Founded in 2014 and based in Portugal, PICadvanced has been developing disruptive and unique solutions for the telecommunications market through its multidisciplinary team. The company offers innovative products and design, development and testing services in the different components of electronics, optics, photonics, digital signal processing and encapsulation.
A pioneering leader in the NG-PON2 market with its transceiver, PICadvanced sets the standard for next-gen technologies, delivering unparalleled performance and reliability. PICadvanced excels in the photonics field and has not only fully developed solutions based on PICs but also conceived proprietary techniques for advanced packaging. This allows the company to conduct cutting-edge research but also to productize their advancements and empower the community with state-of-art tools through trainings and workshops.
| Type | Product ID | Price, EUR | Description |
|---|---|---|---|
| Packaged PIC | PA-MPW-JE-H0-xxx | 6000* | Packaged PIC with proprietary holder interface: SMF fiber interface; DC and RF interface; cooled with TEC. Following PICadvanced packaging design rules |
| Packaged PIC in PCB DC | PA-MPW-JE-H1-xxx | 8000* | Packaged PIC with proprietary holder interface: SMF fiber interface; DC and RF interface; cooled with TEC. Packaged in a control board with graphical user interface, for DC test and monitoring, up to 20 current sources (max 100mA) or voltage sources (max 5V). Following PICadvanced packaging design rules |
| Packaged PIC in PCB RF | PA-MPW-JE-H2-xxx | 10000* | Packaged PIC with proprietary holder interface: SMF fiber interface; DC and RF interface; cooled with TEC. Packaged in a control board with graphical user interface, for DC test and monitoring, up to 20 current sources (max 100mA) or voltage sources (max 5V) and up to 4 RF-SMA connectors without RF driving electronics included. Following PICadvanced packaging design rules |
| Packaged PIC in PCB DC and RF, custom | PA-MPW-JE-H3-xxx | Open quote | Packaged PIC with proprietary holder interface: SMF fiber interface; DC and RF interface; cooled with TEC. Packaged in a control board with DC and RF driving following the user requirements. Following PICadvanced packaging design rules |
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