Packaging
This section is dedicated to the packaging solutions.
Currently we are working with PhotonFirst.
All indicated prices exclude VAT (Value-added-tax).
PHOTONFIRST
As of January 1, 2021, Technobis IPS continues its operations as PhotonFirst (www.photonfirst.com). Information on their new offer is coming soon.
PIConnect & RFconnect
Fraunhofer HHI has developed PIConnect and RFconnect to facilitate PIC evaluation for fast and convenient prototype development up to 40 GHz.
PICadvanced
PICadvanced entered the market with its unique NG-PON2 transceiver and has since been tailoring its roadmap for next-gen technologies. The company excels in the photonics field and has not only developed solutions based on PICs but also conceived proprietary techniques for packaging. This allows PICadvanced to conduct research, productize their innovations, and provide the community with new tools through trainings and workshops.