PIC Design Course 2022

31 October – 11 November in Eindhoven!

This year’s PIC Design Course is aimed to be an on-site event in Eindhoven, respecting the COVID-19 regulations. More information on the course schedule and how to register will follow soon!

The Deep-Dive PIC Design Course is a technology training scheduled for two weeks starting from Monday 31st October 2022. The course covers the theory and practice of integrated photonic components and circuit design using the powerful JePPIX building blocks. Layout and simulation methods are explored with JePPIX software partners and professional designers in hands-on sessions. This course is particularly suitable for engineers who wish to create their first MPW chips and for new Ph.D. students in the field of photonics.

The course will provide both the underlying know-how to enable an understanding of the design space, and the practical skills to implement designs. Participants with specific circuit specifications in mind may also benefit by being able to think through their designs with on-site experts.

Learning Objectives

Participants will gain the ability to identify and specify building blocks and connect building blocks and layout for the creation of functional photonic integrated circuits. Participants will use a range of simulation and design tools suited for active and passive components and circuits and will be able to use foundry specific process design kits to predict circuit performance and create the file sets required for a multi-project wafer run.

Required prior knowledge

The course is expected to be relevant to engineers and scientists who have an awareness of photonics and the underlying principles, and who wish to extend this knowledge to create their first photonic integrated circuits on open access foundries.


Trainees will develop insights into mode analysis to better understand the design space for waveguide based integrated optics and how best to construct interferometers and filters. Active building blocks including semiconductor optical amplifiers, modulators and detectors will be introduced in terms of physical principles and practical implementation as components and circuit elements. Methods for laying out circuits will be developed. Hybrid and monolithic integration schemes will be described.

There is also an emphasis on practical skills, with the opportunity to trial commercial CAD tools, process design kits (PDKs) and to develop insights with expert designers and leading academic instructors. Representatives from the foundries will also be available to talk through the latest platform capabilities. Visits to cleanroom facilities and measurement laboratories are included to provide insights into the role of fabrication tolerances and testing methods on design methods. Packaging will also be reviewed to ensure package, test and manufacture aware design.