JePPIX partners are developing test automation methods to allow customers to remotely characterise chips straight out of the fab, or to partner with a test house like VLC Photonics for such a service. The testing methods are now being integrated into the design environment. Semi-automated die and wafer level testing services are already available for MPW and dedicated runs, and remote automated testing will become available in early 2022.

Fraunhofer HHI offers a PIC evaluation setup called PIConnect, which enables parallel operation of building blocks and convenient evaluation of PICs. More information about PIConnect can be found in this technical note.

Contact us

Contact us for more information about our services, or to discuss your application with us.