JePPIX partners are developing test automation methods to allow customers to remotely characterise chips straight out of the fab, or to partner with a test house like VLC Photonics for such a service. The testing methods are now being integrated into the design environment. Semi-automated die and wafer level testing services are already available for MPW and dedicated runs, and remote automated testing will become available in early 2022.
Fraunhofer HHI offers a PIC evaluation setup called PIConnect3, which enables parallel operation of building blocks and convenient evaluation of PICs. More information about PIConnect3 can be found in this technical note.
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