The JePPIX Pilot Line offers design, production and testing services to take your InP PIC-based prototype into production.
We offer customized service packages based our customer’s needs. The packages can include any combination of services needed for your questions. Take a look at our services by clicking the buttons below:
The design houses translate your applications into PICs. They can help you optimize your design for manufacturing.
Foundries offer robust and reproducible fabrication of customized PICs cut into dies via dedicated wafer runs.
JePPIX partners are developing test automation methods to allow customers to remotely characterise chips straight out of the fab.
Demonstrator Open Call
The JePPIX Pilot Line is now hosting an open call for application experiments to provide support to businesses and catalyse their transition to industrial prototyping and pre-commercial production of high-performance indium phosphide (InP) photonic integrated circuits (PICs). More details can be found here.
Accelerated product development.
The process design kit PDK approach pioneered in our MPW services is now scaling up for full wafer services. Semicon processes become qualified when enough wafers are produced with the same process to gather statistics and understand the variations and design requirements for manufacture. Customers using the JePPIX PDK take advantage of many customers scaling the products using the same, off-the-shelf, high-performance, accurately-modeled processes. This removes non-recurring engineering costs and can reduce the number of iterations when compared with dedicated, customised processes.
The consortium as a whole is not exposed to customer IP, as this is done point-to-point. The customer can decide who to share their IP with. An IP review can be a part of the pilot design product. The outcome of an IP review can include clarifications on licensing fees/models or anticipated royalties when IP is available, and clarity on freedom to operate when blocking IP is identified.
JePPIX collaborates closely with PIXAPP, which offers packaging solutions. The design houses are able to help you design according to PIXAPP capabilities, to ensure your PICs can be easily packaged via PIXAPP. Take a look at the PIXAPP website for more information about their capabilities. JePPIX also works together closely with Technobis and Cordon Electronics on packaging. Take a look here for more information.
Contact us for more information about our services, or to discuss your application with us.
Do you require a few iterations to optimize your design? The multi-project wafer (MPW) platform provides a reduced cost approach in the early prototyping stages. To learn more, click here.
The JePPIX Pilot Line is enabled by the InPulse project.