The importance of photonic integrated circuits (PICs) is growing in a wide range of applications, including communications, optical computing, automotive, aerospace, agriculture and medical. PICs are key enablers to meet the increasing demand for data transfer speed, bandwidth and performance. Our meeting will focus on the latest trends and considerations in the packaging and post-processing of PICs. We will cover a range of topics, including passive and active optical alignment, wafer-level versus die-level packaging and testing, thermal control, cost-effectiveness, volume production versus pricing, and new manufacturing requirements in co-package optics.

Speakers from JePPIX:

10:10 – 10:25 Photonfirst – Elvis Wan, Process Development Engineer (The Netherlands)
10:25 – 10:40 ficontec – Augusto Mandelli, International Sales, Service and Marketing Director (Germany)

This meeting takes place in cooperation with Laser World of Photonics. Read more and register here: EPIC Technology Workshop on PIC Post-Processing & Packaging at the LASER World of PHOTONICS – EPIC Association (epic-assoc.com)