This meeting aims to discuss new trends and considerations for packaging and testing of optical modules including passive/active optical alignment, wafer-level vs die level packaging and testing, thermal control, volume vs prize and new manufacturing needs in co-package optics. Key players in the packaging field will discuss about the adoption of standards, packaging requirements for new applications including quantum photonics.

Keynotes from JePPIX partners:
Peter O’Brien – Head of Research Group, Director of Photonics Packaging Pilot Line at Tyndall/PIXAPP
Josue Parra – Research and Development Engineer at Ficontec

To find out more and to register, visit the website of EPIC: EPIC Online Technology Meeting on PIC Packaging and Testing – EPIC AssociationEPIC Association (epic-assoc.com)