27 – 28 March, on-site
This edition of the Industry Training was attended by 21 participants.

This 2-day industry training program was developed by extracting key modules from our annual 2-week PIC Design Course which were of particular interest for industry professionals. The program gives a conceptual insight into waveguide photonics, optical modes, interference devices, amplifiers, lasers, and modulators. Use cases for creating and analysing circuits with these combinations of building blocks are discussed, as well as assembly and packaging approaches.

The JePPIX industry training is part of the European Photonics Academy organized by PhotonHub Europe.

Learning Objectives

After the course, participants were familiar with the full-design-flow perspective connecting physical principles to practical designs and layouts used in photonic integrated circuits. They have acquired the vocabulary to discuss design choices. Moreover, they have gained an awareness of some of the most important constraints in design due to packaging, design know-how, fabrication tolerances, characterization techniques and materials properties.

Required prior knowledge

Participants are assumed to have a Bachelor, Masters or equivalent industry experience in a scientific or engineering field. They are already familiar with the concepts of waveguides, the properties of light such as amplitude, phase, wavelength and polarization. Additionally, they are familiar with the operating principles of diodes and the concept of electronic bands for describing semiconductor devices. Typical course participants did not follow our 2-week PIC Design Course (yet), or perhaps feel it is too detailed for their objective.

Content

This training program contains four modules:

• Why Indium Phosphide? Application examples (1 hour)
• PIC components (11 hours):
  – Passive building blocks (dielectric waveguide basics, 2D confinement, propagation, curved waveguides, junctions, couplers and splitters, MMI couplers, Arrayed Waveguide Gratings) (7 hours)
  – Active building blocks (SOAs, lasers, RF components (MZI, EAM, detectors)) (4 hours)
• Characterization (1 hour)
• Standardization and packaging (3 hours)

See below for the schedule of the March 2023 edition: