Current Project Overview (continued)
JePPIX partners are currently actively involved in several projects as detailed below
PIXAPP is the world's first open-access pilot line for the assembly and packaging of photonic integrated circuits (PICs). This enables photonics innovators to exploit the breakthrough advantages of PIC technologies. The Pilot Line Gateway office is located at the Tyndall National Institute, in Ireland. PIXAPP bridges the ‘valley of death’ often associated with moving from prototyping to low-volume fabrication. It gives companies an easy-access route to transferring R&D results to the market. PIXAPP consists of a highly-interdisciplinary team of Europe’s leading industrial & research organizations, and provides users with single-point access to PIC assembly and packaging.
PIXAPP is funded by the EU under the Horizon 2020 Programme (Contract No. 73195)
OpenPICs provides a step change in platform maturity for open access generic integrated photonics technology. The project enables innovative product development. It ensures that a technological edge is maintained through the development of high performance building blocks, processes and products. OPENPICS is organized around the following four work packages:
- Market Demands: Translating products making use of photonic ICs, into building blocks, processes and designs.
- Process characterisation: Obtaining data on the production process to improve the production of photonic ICs. So every year, reducing the cost per chip.
- Building Block Improvement: Improving the existing sub-circuits (composite building blocks) with the use of models to predict how building blocks will function when they are produced, leading ultimately to “first-time right” design.
- Process improvement: The optimization and improvement of the production process to allow for more and better basic building blocks.
This project introduces next generation building blocks into generic integration technology. Challenges addressed include
- Selective area growth to enable many different band-gap devices to be created on the same chip at the same time and in combination with a rich range of established generic building blocks.
- Buried hetero-structure active regions for high efficiency and high performance gain blocks which are integrated with the full generic platform
- High speed modulators and RF circuit engineering on semi-insulating (SI) substrates for the wavelength division multiplexed circuits
The test vehicles to be validated in GETPICS have a particular focus on the design and fabrication of high bit-rate transmitter PICs and WDM chip-scale solutions. This is a Marie-Curie project with partners III-V Lab, Palaiseau and Eindhoven University of Technology.