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10th European Photonic Integration Forum at ECOC 2019 in Dublin

  • Royal Dublin Showground (map)
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Tuesday, 24 September

Merrion Room, Royal Dublin Showground (RDS) 18:00 – 20:00

Photonic Integrated Circuits (PICs) are now actively being developed in multiple market sectors, far beyond telecommunications and datacomm, impacting product developments in aerospace, industrial internet of things, automotive sensors, diagnostic tools in healthcare through to fibre-optic sensing. The barriers to entry have been radically reduced with the open access model pioneered in Europe, enabling businesses large and small to innovate and researchers to push technology limits. Manufacturing pilot lines are now facilitating a route to production through more robust design flows and processes. New research directions are enabling combinations of technologies.

The EUROPEAN PHOTONIC INTEGRATION FORUM holds its 10th edition at ECOC in Dublin. This provides an excellent opportunity to:

  • Network with Europe’s open access community, and hear about the latest achievements on silicon photonic, silicon nitride and indium phosphide integration platforms

  • Learn how the latest prototyping and pilot production services can impact your own PIC development programs and ambitions

  • Meet with the full eco-system of designers, foundries, test automation specialists, package developers and CAD tool developers over complimentary drinks and a bite to eat.

    Agenda:

    17:30 – 18:00 Welcome drink
    18:00 – 18:10 Introduction of JePPIX and ePIXfab
    18:10 – 18:30 Talk by Prof. Dries Van Thourhout (Ghent University – imec)

    18:30 – 19:10 Networking + Refreshments
    19:10 – 19:30 Talk by Dr. Kai Shi (Microsoft)
    19:30 – 20:00 Networking + Refreshments

The event and drinks are free of charge. Due to room capacity limits, we ask for registration to ensure admittance. Register at epif2019.eventbrite.com.

Invited Speakers:

 
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Prof. Dries Van Thourhout, Ghent University

Title: New materials for advanced silicon photonics based transceivers
Summary: It is clear that silicon photonics requires a directly integrated laser source using wafer- scale technologies, and an efficient modulator without any coupling between amplitude and phase modulation to implement low power and high speed integrated transceivers. To achieve these targets, an increasing amount of research is geared towards the integration of novel materials and the development of new integration methods on the silicon photonics platform. This presentation will give a review of the state-of-the-art in this domain, covering novel methods for III-V integration, novel materials for pure phase modulation (LN, BTO, PZT, polymers, 2D-materials) and novel materials focusing on pure amplitude modulation (Ge, SiGe, Graphene).

 
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Dr. Kai Shi, Microsoft

Title: Prototyping of a sub-nanosecond wavelength
switching source using JePPIX
Summary: An all-optical switch can potentially reduce the cost and power consumption of today’s data center networks, by eliminating opto-electronic conversions. A fast wavelength tunable source is a key component to enable fast network reconfigurability. In this presentation, we will share some of our experiences of prototyping a sub-nanosecond wavelength switching source using the JePPIX platform.

About organizers:

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JePPIX - the joint European platform for photonic integrated components and circuits provides low-cost access to advanced indium phosphide and silicon nitride photonic integration processes. JePPIX connects the complete value chain for a seamless design flow from concept to packaged part for multiproject wafer prototyping runs, and now starts Pilot Line manufacturing.

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ePIXfab is the European alliance of companies and research institutes that promotes silicon photonics science, technology and applications. ePIXfab members cover the entire supply chain of silicon photonics prototyping and manufacturing. ePIXfab organizes training and workshops and is involved in roadmapping activities.

 

Attend EPIF to network with our Partners:

Foundries, Pilot lines, Research institutes:

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Design Houses:

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Software Providers:

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Packaging:

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Brokers:

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