JePPIX: the road to a multi-billion Euro market in InP-based Integrated Photonics

In the coming years the generic foundry approach will cause a revolution in micro and nanophotonics, just like it did in microelectronics thirty years ago. In Europe, three integration technology platforms are active for introducing the generic foundry concept for the major integration technologies in Photonics: JePPIX for InP-based monolithic integration, ePIXfab for silicon photonics, and TriPleX for low-loss dielectric waveguide technology. In this report, a roadmap for the development of generic InP-based integration technology is presented. It is a first version in a series, and will be updated and improved on a yearly basis.

COBRA-ASML Symposium

• Trends in Photonics for ICT, prof. Harm Dorren, director COBRA
• Trends in Lithography, dr. Rob Hartman, director ASML
• Photonics and the Dutch Innovation Program, Guus Broesterhuizen, director NL Innovation
• Photonic Integration Technology, dr. Mike Wale, research director Oclaro
• Photonic Interconnect, dr. Ronald Luijten, Data Motion Architect, IBM Research
• Opening of the ASML Scanner System in the COBRA cleanroom, Prof. Meint Smit

Program Meeting IOP Photonic Devices,
STW Generic Technologies for Integrated Photonics (GTIP) and
STW Smart Optic Systems

• Relevance of Platform Technologies in Photonics, dr. Bart Verbeek, IOP Photonic devices
• Challenges and Achievements in Generic Integration Technologies, prof. Meint Smit, COBRA TU/e and chairman STW GTIP program
• IOP project UV RGB Combiner, Ger Folkersma, UTwente
• GTIP project IMOS, dr. Jos van der Tol, COBRA – TU/e
• IOP project Compact Handheld OCT, Willem Bleeker Lionix
• GTIP project: Gas detection in the infrared using spectroscopic techniques, Adonis Reyes Reyes MSc., TUDelft
• STW SOS project Smart Optics Systems in IC lithography equipment, prof. Rob Munnig Schmidt, TUDelft

• Photonic Integration in Optical Transport Networks, Dr. Alfredo Viglienzoni, Ericsson, Head Strategic Programs, and Chair Work Group 1 (ICT) of the Photonics21 platform
• Photonic Integration in access networks, Dr. Gerlas van den Hoven, CEO Genexis, NL
• Photonic Integration for interconnect, Prof. Wim Boogaerts, IMEC, BE
• Photonic Integration in health, Dr. Jeroen Kalkman, Academic Medical Centre, Amsterdam
• Photonic Integration for fibre sensors, Mr. Pim Kat, CEO Technobis, NL
• Photonics21 & Photonic Integration, Dr. Mike Wale, Oclaro, and Chair Work Group 6 (Design and Manufacturing of Optical Components and Systems) of the Photonics21 platform
• Moving towards generic foundries for photonic integrated circuits, Prof. Roel Baets, University of Ghent/IMEC
• JePPIX, EuroPIC and PARADIGM, Dr. Xaveer Leijtens, TU Eindhoven
• ePIXfab & HELIOS, Dr. Laurent Fulbert,  CEA-LETI, FR
• OpSIS: Fabless silicon photonics, Prof. Michael Hochberg, University of Washington
• Lehigh-RSoft-CyOptics consortium, Prof. Tom Koch, Lehigh University, PA
• TriPleX: A commercial foundry platform for visible and infrared wavelengths, Dr.ir. Rene Heideman and dr.ir. Arne Leijnse, Lionix BV, NL

Packaging Technologies

• Introduction, Michael Robertson, CIP
• Review of packaging developments, Bob Musk, Gooch & Housego
• Low-cost packaging for low optical port counts, Bob Musk, Gooch & Housego
• Low cost packaging for high optical port counts, Michael Robertson, CIP
• Packaging TriPleX chips, Arne Leijnse
• Submicron alignment approaches, Hans van Gurp, Marcel Tichem, TU Delft
• The packaging provider ePIXpack, Lars Zimmermann
• Packaging at IZM, Hermann Oppermann, Faunhofer IZM
• Packaging at Oclaro, Paul Firth, Oclaro

Packaging Requirements

• Oclaro (Paul Firth)
• TE Connectivity (Michiel Boermans)
• COBRA (Meint Smit,)
• ASTRON (Peter Maat)
• Satrax (Chris Roeloffzen)
• Technobis (Pim Kat)
• 2M Engineering (Jan Mink)
• University Cambridge (Adrian Wonfor)
• TNO (Peter Harmsma)